FEATURES:

    Special Designed BGA Chip's Platform keeps BGA Chips separated from stencil  without ball lose.

STRUCTURE:

Multiple Usage BGA REBALL KIT：PLATFORM  —— BGA LOADER —— TOPCOVER and STENCIL.

INTRODUCE:

1.PLATFORM：Dimension 90*90*70mm,

Material : Aluminum Alloy. for carry the BGA LOADER Purpose.

2.BGA LOADER：

Material : Aluminum Alloy.According to different size to set up the BGA Chip's Mold,for posit BGA Chip in BGA LOADER.

3.TOPCOVER：

Material : Aluminum Alloy

Fix the stencil in Topcover with screws for REBALLING and SOLDER PASTE purpose.

4.STENCIL :

There are two kind of stencils for BGA Reballing and BGA solder paste purpose that applied in "BGA REBALL KIT".Orginal BGA STENCIL pin pitch is 1.0mm and 1,27mm, Thickness is 0.3mm . Solder Paste Stencil Thickness is 0.1mm ~ 0.12mm.Stencil Thickness 0.1mm~0.25mm  is applied in BGA pin pitch below 1.0mm Chips.