BGA SOCKET , EZKIT CO,.LTD.X86 OEM and ODM provide

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BGA TEST SOCKET:

FEATURES: 

1.No mechanical limitation for various boards.

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2.Applied in Ball type and Non Ball type BGA Chips.

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3.Long term and Burn-In test in available.

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4.Life span above 10000 times.


BGA´ú¸Õ®y

STRUCTRE:
¡]1¡^Adaptor¡X¡X¡]2¡^Receptackle¡X¡X¡]3¡^Fix board¡X¡X¡]4¡^down section of test socket¡X¡X¡]5¡^Hight flexiable stainless jacker    ¡X¡X(6)Up section of test socket¡X¡X(7)Pluger¡X¡X(8)Protect board¡X¡X(9)Topcover(Aluminum).

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INTRODUCE:

1.Adaptor¡GConnector of BGA Test Socket and Motherboard .

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2.Fix board¡GProtecting Receptackle and maintaining  every Receptackles' pin pitch.

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3.Receptackle¡GConnector of Barrel and Pluger , Gold plating for ensuring signals transmission


4.Up section and Down section of Test Socket : Clamp the High flexiable stainless jacker.

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5. Barrel and Plunger¡G4 point crown for ensuring better signal connection with BGA Chips.


6.Protect board¡GProtect Barrel and Plunger and Maintain the connection pin pitch.


7.Topcover(Aluminum)¡GApplied in fixing the BGA Chips in Socket.(Ball type and Non Ball type is available).

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REMARKS and NOTES:

1.Avoid any devices and equipments damage PLS ensure the Operating Environment without electricity when you are operating.

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2. If the displays can not be light or Debug Card Seven-Segment is flashing

PLS shut the power down immediately to preventing any damage.

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