FEATURES:
1.No mechanical limitation for various
boards.
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2.Applied in Ball type and Non Ball type
BGA Chips.
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3.Long term and Burn-In test in
available.
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4.Life span above 10000 times.

STRUCTRE:
¡]1¡^Adaptor¡X¡X¡]2¡^Receptackle¡X¡X¡]3¡^Fix board¡X¡X¡]4¡^down section of test socket¡X¡X¡]5¡^Hight flexiable stainless
jacker ¡X¡X(6)Up section of test socket¡X¡X(7)Pluger¡X¡X(8)Protect
board¡X¡X(9)Topcover(Aluminum).
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INTRODUCE:
1.Adaptor¡GConnector of BGA Test Socket and
Motherboard .
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2.Fix board¡GProtecting Receptackle and maintaining
every Receptackles' pin pitch.
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3.Receptackle¡GConnector of Barrel and Pluger , Gold
plating for ensuring signals transmission
4.Up section and Down section of Test Socket : Clamp the High
flexiable stainless jacker.
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5. Barrel and Plunger¡G4 point crown for ensuring
better signal connection with BGA Chips.
6.Protect board¡GProtect Barrel and Plunger and Maintain the
connection pin pitch.
7.Topcover(Aluminum)¡GApplied in fixing the BGA Chips in Socket.(Ball
type and Non Ball type is available).
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REMARKS and NOTES:
1.Avoid any devices and equipments damage PLS ensure
the Operating Environment without electricity when you are
operating.
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2. If the displays can not be light or Debug Card
Seven-Segment is flashing
PLS shut the power down immediately to preventing any
damage.
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