Reballing Stencil Thickness is 0.3mm

Solder Paste Stencil Thickness is 0.1~0.12mm

Multiple usage Stencil

INTRODUCE:

There are two kind of stencils for BGA Reballing and BGA solder paste purpose that applied in "BGA REBALL KIT".Orginal BGA STENCIL pin pitch is 1.0mm and 1,27mm, Thickness is 0.3mm . Solder Paste Stencil Thickness is 0.1mm~0.12mm.Stencil Thickness 0.1mm~0.25mm  is applied in BGA pin pitch below 1.0mm.

 EZKIT CO,.LTD also offers the service that set up SMT and BGA reballing stencil for customers