EZKIT CO,.LTD.X86 OEM and ODM provider

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    EZKIT CO,.LTD provides        
  
     OEM and ODM service.

     Hardware Design service
 
     Reballing BGA and Test service.
                       
     for our customers.


T E L：（00886）02-22503470 
 
F A X：（00886）02-22507361 

E-mail： sales@ezkit.com.tw

Skype：ezkit_ming
 
Q   Q：331228686

A D D：1F,No13,Alley 6,Lane 23,

       Yangming St,Taipei 

       CountryTaiwan.

BGA TEST SOCKET
	Easy to maintaining. Applied in both Ball type and Non Ball type BGA functional test. Long term span > 10000 times. Burn-In type is available.
BGA REBALL KIT
	Enable to reballing your BGA easier. Low cost solution for customer.
STENCIL
	Applied in BGA REBALL KIT OEM and ODM is available.
SOLDER BALL
	Brand : PMTC Diameter tolerance : +0.015mm ~ -0.015mm. Spheroid tolerance :≤1.5%. Tin Lead and Lead Free is available.
IC TEST SOCKET
	Brand : ENPLAS,YAMAICHI,Wellscti,3M… Package : SOP,TSOP,QFP,PLCC…
DEBUG CARD
	DEBUG CARD with PCI interface DEBUG CARD with Mini PCI interface
IDE TO CF CARD
	One 40/44 Pin IDE Connector One CF Socket,Support CFII